| 摘要 |
PROBLEM TO BE SOLVED: To maintain the strength of a wafer by carrying it without causing deformation in carrying the processed wafer to a subsequent process. SOLUTION: Water such as pure water is supplied from a water supply nozzle to the surface of the wafer 1 returning to a loading/unloading position after processing, and then, a liquid such as water-soluble resist is dropped from a liquid supply nozzle. A chuck table is rotated to mix the water and liquid on the surface of the wafer 1 and dried to form a protective film 8 on the surface of the wafer 1. A suction surface 79a of a suction pad 79 is pressed on the protective film 8 so that the wafer 1 can be sucked and held on the suction pad 79. After that, a recovering arm 80 turns around to carry the wafer 1 to a spinner type cleaning apparatus as a carrying destination, and the protective film 8 formed on the surface of the wafer 1 is removed by cleaning in the spinner type cleaning apparatus. COPYRIGHT: (C)2008,JPO&INPIT
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