LIGHT EMITTING DIODE PACKAGE

摘要

An LED(light emitting diode) package is provided to minimize the loss of light caused by absorption or scattering of a package by mounting an LED chip in an LED chip mounting space part defined in a leadframe made of a conductive reflection member. A leadframe(50) is made of a pair of lead terminals, having a space part(50a) for defining an LED chip mounting space on the upper surface of the pair of lead terminal. A part of the leadframe is received in a package(20) having a radiation window opened to radiate light. An LED chip(60) is mounted in the upper space part of the leadframe in the package. The LED chip is electrically connected to the leadframe by a wire(70). A molding material(80) protects the LED chip and the wire, filled in the package. The spacer part of the leadframe is made of a groove having a minimum depth for burying the LED chip. The leadframe can be made of a conductive reflection member.