ADDITIVE FOR COPPER PLATING AND PROCESS FOR PRODUCING ELECTRONIC CIRCUIT SUBSTRATE THEREWITH,申请号KR20077004695-传众专利搜索

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发明名称	ADDITIVE FOR COPPER PLATING AND PROCESS FOR PRODUCING ELECTRONIC CIRCUIT SUBSTRATE THEREWITH
摘要
申请公布号	KR20070048211(A)	申请公布日期	2007.05.08
申请号	KR20077004695	申请日期	2004.08.18
申请人	EBARA-UDYLITE CO., LTD.	发明人	ISHIZUKA HIROSHI;SAKAGAWA NOBUO;KIMIZUKA RYOICHI;DOW WEI PING
分类号	C25D3/38	主分类号	C25D3/38
代理机构		代理人
主权项
地址

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