MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

A manufacturing method of a semiconductor device is provided to improve damage of a pattern by selecting automatically a sensor and setting a narrow sensing margin region. A location process is performed to locate a wafer(5) under a mask. A wafer exposure process is performed to expose the wafer by using a scanner. The exposure process is performed to form an inner part to an outer part of an edge of the wafer while the edge of the wafer is exposed. A chip formed at the edge of the wafer is exposed from the inner part to the outer part of the edge of the wafer. A plurality of sensors are formed at the scanner in order to perform automatic focus control and leveling operations.