SEMICONDUCTOR DEVICE HAVING IMPROVED PAD STRUCTURE

摘要

A semiconductor device is provided to secure a high assembly yield by restraining the generation of a wire bonding error using an improved pad structure with a stepped portion. A semiconductor device includes a semiconductor chip and at least one or more pads on the semiconductor chip. Each pad is composed of a first region and a second region. The first region(110) is connected with a probe tip in a test mode. The second region(210) is performed with a wire bonding process in order to transmit/receive a predetermined signal to/from the outside. A stepped portion is formed between the first and second regions in order to discriminate the first region from the second region in the test mode.