| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device, which is easy in mounting handleability and can be made thiner in thickness than a conventional chip size package, and to provide its manufacturing method. <P>SOLUTION: The piezoelectric device 10 is formed by coupling an element section 11 to a reinforced plate 20 which are faced and arranged. The element section 11 has: a thin film section comprising an insulating film 14, faced paired electrodes 15, 17 placed on the insulating film 14 at its center portion, and a piezoelectric film 16 sandwiched by the electrodes 15, 17; pads 18, 19 placed on the insulating film 14 at its peripheral sections and electronically connected to the electrodes 15, 17, respectively; and external electrodes 35, 36 placed on the other sides of the pads 18, 19 of the insulating film 14 and electronically connected to the electrodes 15, 17. The reinforced plate 20 has lands 21, 22 formed on the side facing the element section 11 and connected to the pads 18, 19 of the element section 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
