ADDITIVE FOR COPPER PLATING AND PROCESS FOR PRODUCING ELECTRONIC CIRCUIT SUBSTRATE THEREWITH

摘要

An additive for copper plating, comprising a specified nitrided biphenyl derivative as an active ingredient; a copper plating solution containing a copper ion component and an anion component, obtained by addition of this additive for copper plating; and a process for producing an electronic circuit substrate furnished with minute copper wiring circuit, comprising performing electroplating in this copper plating solution with the use of an electronic circuit substrate having microgrooves and microholes of electronic circuit wiring pattern provided on its surface as a negative electrode. This additive for copper plating, even when comprised of one type of component, can attain plugging of through-holes and via holes of micron and submicron levels. Management of the copper plating solution in which use is made of this additive for copper plating is extremely easy, and plugging of through-holes and via holes can be stably performed therewith for a prolonged period of time.