| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging structure which can reduce a cost, even when an electronic part is mounted in an FPC substrate via a circuit substrate, and to provide an electro-optical device and an electronic apparatus having this electro-optical device. SOLUTION: In the electro-optical device 1, a plurality of electronic components 5 are collectively mounted in the circuit substrate 30, and this circuit substrate is mounted in the second FPC substrate 40, consisting of one side substrate. Further, the second FPC substrate 40 is connected to the first FPC substrate 20 made of a double-sided substrate, and the first FPC substrate 20 is connected to an element substrate 111. When the first FPC substrate 20 is bent, the second FPC substrate 40 is bent, and the circuit substrate 30 is disposed inside of the bending part 200 of the first FPC substrate 20. COPYRIGHT: (C)2005,JPO&NCIPI
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