摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board, capable of preventing cracks from occurring in a through conductor, and to improve reliability in the connections of the wiring board. SOLUTION: In the wiring board, including an insulating layer 3 containing glass cloth 1 and resin, a through hole 5 passing through the insulating layer 3, and the through-conductor 7 formed inside the through hole 5, the recess 17, formed of the glass cloth in a recessed shape, is provided to the inner wall of the through hole 5. COPYRIGHT: (C)2005,JPO&NCIPI
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