| 摘要 |
PROBLEM TO BE SOLVED: To increase the reliability of junction parts between electrodes of electronic components and electrodes of an electronic circuit board, to secure the reliability of insulation between adjacent electrodes, and to package the electronic components to the electronic circuit board at a low cost. SOLUTION: A method for packaging the electronic components comprises the steps of firstly positioning the electronic components to the electronic circuit board with the use of a conventional positioning device, heating to melt a plurality of first projecting parts composed of a low melting point material formed on the electronic components, contacting the melted first projecting parts to a second projecting part on the electronic circuit board formed by the same material as that of the first projecting parts, and secondly positioning with self-alignment by a stress caused by an integration of the melted first and second projecting parts. COPYRIGHT: (C)2004,JPO&NCIPI
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