| 摘要 |
An optical module includes a semiconductor package, a holder holding the semiconductor package, and a metal casing having a bottom surface, first and second confronting sidewalls, and third and fourth confronting sidewalls. The first sidewall has a pair of parallel edges defining a cutout extending to the bottom surface. The holder is accommodated within the metal casing on the bottom surface in a state where the metal casing is positioned by the pair of parallel edges, the third and fourth sidewalls and the bottom surface, so that the semiconductor package extends outside the metal casing via the cutout.
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