发明名称 |
Laminate for packaging and package |
摘要 |
A packaging multilayer material 14 is formed by sequentially laying an air permeable heat-resistant fiber material layer 11 having a heat-resistance of not lower than 150° C., a polyethylene type resin spunbonded non-woven fabric layer 12 and a microporous film layer 13 in the above listed order by means of thermal bonding. The air permeable heat-resistant fiber material layer 11 is made of resin spunbonded non-woven fabric having a melting point between 150 and 300° C. and the polyethylene type resin spunbonded non-woven fabric layer 12 is an ethylene-alpha-olefin copolymer having a density between 880 and 950 kg/m<3>, while the microporous film layer 13 is made of polyethylene type resin.
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申请公布号 |
US2004077248(A1) |
申请公布日期 |
2004.04.22 |
申请号 |
US20030468824 |
申请日期 |
2003.08.25 |
申请人 |
KURAHASHI AKIHIKO;NAKAGAMI HIROYUKI;MITSUZUKA HIROYUKI |
发明人 |
KURAHASHI AKIHIKO;NAKAGAMI HIROYUKI;MITSUZUKA HIROYUKI |
分类号 |
B32B5/26;B32B27/02;B32B27/12;B32B27/32;B65D81/18;B65D81/26;B65D81/28;D04H13/00;(IPC1-7):D04H3/16 |
主分类号 |
B32B5/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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