| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing system by which the thickness of a film can be measured with high accuracy by measuring specific points (fixed points) on the surface to be polished of an object to be polished and which can be downsized as a whole. <P>SOLUTION: The polishing system is provided with a top ring 30 for retaining a semiconductor wafer W and a polishing table 20 having a polishing surface and polishes the semiconductor wafer W by sliding the semiconductor wafer W against its polishing surface. A thickness measuring device 150 having a light source 154 for irradiating the surface to be polished of the semiconductor wafer W with light of a predetermined wavelength, a spectroscope 155 for dispersing light reflected from the surface to be polished and a CCD array 156 for taking the light dispersed by the spectroscope 155 in are buried in the polishing table 20. The polishing system also has a controller 160 which obtains the thickness of arbitrary points on the surface to be polished by analyzing information about the whole surface to be polished which is taken in by the CCD array. <P>COPYRIGHT: (C)2004,JPO |
