| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead cutting method for an electronic component to be executed after incorporating electronic component chips into a lead frame and collectively sealing a plurality of electronic components chips as an assembly, which is capable of cutting and removing the leads without causing shear drop on a cutting surface or residual strain on a processed surface. <P>SOLUTION: In the lead cutting method for the electronic component to be executed after mounting a plurality of electronic component chips on the lead frame and collectively sealing the plurality of electronic components chips as the assembly to process the chips into a resin seal, removing of the resin for covering a portion of each lead to be cut and cutting of each lead which is exposed from the portion to be cut by the cutting are carried out by one-time irradiation of a laser beam at the same wavelength. <P>COPYRIGHT: (C)2003,JPO</p> |
