发明名称 PROCESSING METHOD OF LEAD WIRE TIP COATING
摘要 PROBLEM TO BE SOLVED: To make a coating of a lead wire easily peeled off when soldering without peeling off the coating in advance. SOLUTION: An incision line 9 is formed on the border part of a coated part 7 to be peeled off when soldering at a tip 6 of a lead wire 5, and the coated part 7 to be peeled off is peeled off while leaving the coated part 7 to be peeled off as it is. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003178734(A) 申请公布日期 2003.06.27
申请号 JP20010376777 申请日期 2001.12.11
申请人 TOCAD ENERGY CO LTD 发明人 AZUMA SHIGERU
分类号 H01M2/10;(IPC1-7):H01M2/10 主分类号 H01M2/10
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