Chip module housing has semiconductor chip supported in central opening in housing plate via holding frame

摘要

The housing has a housing plate (1) in the form of a conductive metal frame, provided with a central opening (4) and a holding frame, supporting a semiconductor chip (3) attached to the holding frame within the opening. An adhesive or resin mass can be provided between the housing plate and the chip. An Independent claim for a chip module is also included.