| 摘要 |
PURPOSE: A semiconductor chip package and a method for fabricating the same are provided to form a connection terminal by using a conductive support plate as a stiffener without using an additional lead frame and performing a half etching process of the lead frame. CONSTITUTION: A photoresist layer is formed by coating a photoresist on a conductive support plate(50). A pattern forming film is adhered on an upper portion of the photoresist layer. An ultraviolet ray is irradiated thereon and an unhardened part is developed and removed by using a sodium carbonate solution. A metal layer(52) is formed on an exposed part of the conductive support plate(50). An external connection plated layer(53) and a wire bonding plated layer(54) are sequentially formed on an upper portion of the metal layer(52). A plurality of intermediate layers can be formed between the external connection plated layer(53) and the wire bonding plated layer(54). A non-active side of a semiconductor chip(56) is adhered on a center of a surface of the photoresist layer by using an epoxy adhesive(55). An electrode terminal(56a) of the semiconductor chip(56) is connected with the wire bonding plated layer(54) by using a bonding wire. A package body(59) is formed by encapsulating the semiconductor chip(56), the wire bonding plated layer(54), and the bonding wire. The photoresist layer is removed by using an organic solvent or a potassium hydroxide solution. The metal layer(52) is separated from external connection plated layer(53). |
