SEMICONDUCTOR CHIP AND PRODUCTION METHOD FOR A HOUSING

摘要

The invention relates to a selective covering, which covers the terminal contact surfaces (3, 4) and bonding wires (5) with a casting compound (8) and which leaves active areas exposed, particularly a contact area (6) for a finger in a fingerprint sensor. To this end, the chip surface is selectively adapted by the provision of a varying roughness or coating and/or the viscosity of the casting compound is modified by irradiating the same.