| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part where a protective film is accurately provided on a wiring layer with no strict alignment for improved heat-resistance, insulation characteristics, and reliability. SOLUTION: Related to the electronic part as well as its manufacturing method, at least one conductive layer is formed on a substrate. An exposed part is provided where an insulating resin layer is provided at least at a part of the conductive layer while no insulating resin layer is provided at least at a part of the conductive layer. The insulating resin layer is formed by an electrodeposition method using an aqueous medium containing organic solvent soluble polyimide after the conductive layer is masked, and the exposed part is provided by removing the mask. After the insulating resin layer is formed by the electrodeposition method using the aqueous medium containing the organic solvent soluble polyimede at the conductive layer, the mask is applied for etching process and then the mask is removed, with the exposed part provided by the etching process. |
