发明名称 HIGH FREQUENCY HEATING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent a joint part of a wave guide and a heating chamber in a high frequency heating device due to vibrations in transportation or a shock of dropping. SOLUTION: The high frequency heating device is provided with a body case 8, a heating chamber 3 for heating foods, a high frequency generation device 2 for generating a high frequency, and a wave guide 1 having a high frequency generation device mounting part 6 for conducting the high frequency generated in the high frequency generation device 2 to the heating chamber 3. One end of the high frequency generation device mounting part 6 is joined by a joint part 4 with the heating chamber 3 and a flange 9 is provided on the other end. The mounting part 6 and the body case 8 are fixed. With this constitution, an excess force is not applied to the joint part 4 and the joint part 4 is not dislocated even if vibrations in transportation or a shock of dropping is applied thereto.
申请公布号 JP2002008848(A) 申请公布日期 2002.01.11
申请号 JP20000185839 申请日期 2000.06.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUMORI MASATO
分类号 H05B6/70;F24C7/02;H05B6/64;(IPC1-7):H05B6/70 主分类号 H05B6/70
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