| 摘要 |
<p>PURPOSE: A method for manufacturing a package applying a redistribution metallic wiring technology is provided to apply improved redistribution metallic wiring technology and to reduce manufacturing steps. CONSTITUTION: The method for manufacturing the package includes following steps. At first, a substrate for forming a device and a bonding pad is provided. Then, the first isolation layer(23) exposing the bonding pad is formed on an overall structure. At third, a redistribution metallic wire seed layer is formed along with the surface of the over the all surface. The, the first photosensitive pattern is formed on the redistribution metallic wire seed. Then, the redistributed metallic wiring is formed by an electric chemical vaporization on the redistributed metallic wiring seed layer. Then, the first photosensitive pattern is removed. At seventh, the second photosensitive pattern for defining a solder ball pad is formed on the overall structure. Then, a solder ball pad is formed on the exposed redistributed metallic wiring. At ninth, the second photosensitive pattern and the exposed redistributed metallic wiring seed layer is removed. At tenth, the second isolation layer is formed. Then, the second isolation layer is chemically-mechanically polished. Then, a solder ball(27) is formed on the solder ball pad.</p> |
