| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of glass working and improve the yield of glass working and, at the same time, to improve the reliability of a capacitive sensor. SOLUTION: Since sensing electrodes 121 are exposed on the surface of glass 12 by utilizing first through holes 125, the influence of the damping characteristic of a gas on the electrodes 121 can be reduced by utilizing the holes 125. Correction electrodes 122 are passed through the passage 127 of a silicon substrate 11 and on the side faces of a second through hole 126 provided in the side edge sections of chips and folded on the surface of the glass 12 to form wire bonding pads 124. The then used holes are formed by using the corner sections of sensor chips and, in this case, four chips can commonly use one hole. A silicon electrode pad 111 is also formed in the second through hole 126.
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