发明名称 Gas distribution apparatus for semiconductor processing
摘要 A gas distribution system for uniformly or non-uniformly distributing gas across the surface of a semiconductor substrate. The gas distribution system includes a support plate and a showerhead which are secured together to define a gas distribution chamber therebetween. A baffle assembly including one or more baffle plates is located within the gas distribution chamber. The baffle arrangement includes a first gas supply supplying process gas to a central portion of the baffle chamber and a second gas supply supplying a second process gas to a peripheral region of the baffle chamber. Because the pressure of the gas is greater at locations closer to the outlets of the first and second gas supplies, the gas pressure at the backside of the showerhead can be made more uniform than in the case with a single gas supply. In one arrangement, the first and second gas supplies open into a plenum between a top baffle plate and a temperature controlled support member wherein the plenum is divided into the central and peripheral regions by an O-ring. In a second arrangement, the first gas supply opens into the central region above an upper baffle plate and the second gas supply opens into the periphery of a plenum between the upper baffle plate and a lower baffle plate.
申请公布号 US6245192(B1) 申请公布日期 2001.06.12
申请号 US19990343690 申请日期 1999.06.30
申请人 LAM RESEARCH CORPORATION 发明人 DHINDSA RAJINDER;HAO FANGLI;LENZ ERIC
分类号 H05H1/46;C23C16/44;C23C16/455;H01J37/32;H01L21/302;(IPC1-7):C23F1/02 主分类号 H05H1/46
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