| 摘要 |
A printed circuit board 100 comprises a substrate 102 and a plurality of conductive traces 104-116 formed on the surface of the substrate 102. The conductive traces 104-116 include a marker trace 104 which is formed through the same process and of the same material as the other conductive traces 106-116 used for electrical signal transmission. The marker trace 104 may be so formed as to surround a desired footprint FP1 of a double-sided adhesive sheet 140 to be bonded on the printed circuit board 100. In this manner, a marker, such as the marker trace 104, may be formed without any need for additional and/or dedicated marker-forming process.
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