| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of processes, which are needed for forming a wiring pattern, and the processing time for the pattern by forming a pattern, using a conductive paste on a transparent substrate, which is used as a base for reducing the cost of the material for the substrate, whereby to realize cost reduction in a solid-state image pickup device, and moreover to make irregularities in the pressure at the time of a pressure bonding of a bump to the pattern, which is associated with an irregularity in the depth of the bump and a warpage in a solid-state image sensing element, absorb by the pattern even though there are irregularities in the height of the bump and the warpage is generated in the element, whereby to enable to obtain the state of the good electrical bonding between the substrate and the element. SOLUTION: This device is constituted into a structure, wherein the device is provided with a solid-state image pickup element 3, with a bump 7 formed on an electrode pad 6 and a transparent substrate 2 having a wiring pattern 4 formed of a conductive paste. In this case, the bump 7 is connected with the pattern 4 formed of the conductive paste to electrically bond the substrate 2 with the element 3. |
