| 摘要 |
<p>PROBLEM TO BE SOLVED: To read letters on the surface of an object without being affected by noise due to the scattering light and to perform accurate positioning, by picking up the image of the object through the use of an infrared camera, and reading and identifying an identification code on the surface on the basis of the difference between the heat absorption factors of the identification code and other parts. SOLUTION: In a loader chamber, the image of the surface of a wafer W is picked up by an infrared camera 22 inside the loader chamber to obtain an image color-coded on the basis of the difference of wavelengths of the infrared rays. Therefore, as an identification code D is marked with a color different from that of a protective film around it when the image of the wafer W is picked up by the camera 22 in the loader chamber, it is possible to read the identification code D. In addition, in a prober chamber, the image of an IC chip, a characteristic part of the surface of the wafer W, is picked up by an infrared camera provided as an alignment mechanism to position the wafer W. As an electrode pad exposed from a protective film is displayed in a different color when the image of the surface of the wafer W is picked up by the infrared camera, it is possible to position the wafer W on the basis of the location of the detected electrode pad.</p> |
