| 摘要 |
PROBLEM TO BE SOLVED: To enhance connection reliability of flip-chip mounting by filling the surface on the electrode pad side of a semiconductor device with sealing resin, while surrounding the side face of solder bumps formed thereon and making thin the rear surface of a semiconductor substrate, thereby enhancing strength at the joint. SOLUTION: A spherical bump 20 of high melting point solder is formed at each electrode part of individual semiconductor LSIs 11 on a semiconductor wafer 10. The entire surface of the semiconductor wafer 10 is then spin coated with a sealing resin 21, e.g. epoxy resin, which is cured through heat treatment at about 150 deg.C for about 5 hours. Since the periphery of the solder bump 20 is filled with the sealing resin 21 before the semiconductor wafer 10 and a semiconductor substrate 12 are made thin by mechanical grinding, the mechanical strength of the semiconductor substrate 12 is enhanced. Handling of a thin semiconductor substrate 12 is facilitated, and the yield of the semiconductor LSI is increased. |
