| 摘要 |
PROBLEM TO BE SOLVED: To provide a layer opening method/device in the local region of a semiconductor element, which specify an arbitrary observation desired part, polish it, and open a layer even if a wafer is as it is. SOLUTION: A process where a fine polishing brush 12 is brought close to an observation desire part 11 of a semiconductor wafer 10 from above, a process where the polishing brush 12 is brought into contact with the semiconductor wafer 10 while polishing compound is applied to it, and the polishing brush 12 is moved and only a region to which the polishing brush 12 is brought close is polished mechanically and a process where polishing waste occurring in the polishing process is removed, and a layer is opened during the manufacture process of the semiconductor wafer 10 are provided.
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