| 摘要 |
A chuck table (10) can accommodate a silicon or gallium arsenide wafer (12) placed face down on the wafer. A backing tape (14) is applied to the wafer (12) such that the tape (14) and wafer (12) can be easily removed from the chuck table (10) without damaging the wafer (12). The chuck table includes a relatively flat center portion to support the wafer, an outer radial region made up of concentric grooves, a top surface made up of Teflon 3, and an internal manifold system that supplies air pressure to the underside of the backing tape to force the tape and wafer assembly from the chuck table. |
