发明名称 Semiconductor device
摘要 A semiconductor device comprises a semiconductor layer on an insulator film that is contiguous to a semiconductor substrate. A component, such as a high-voltage diode, forming region is provided in the semiconductor layer and electrically insulated from other component forming regions. A substrate access region is provided in the semiconductor layer and electrically insulated from the component forming region. The substrate access region includes a conductive zone, which extends from the surface down through the semiconductor layer and insulator film to the substrate. A substrate contact is in contact with the conductive zone. The substrate contact and an anode contact of the diode are subject to the same potential.
申请公布号 GB9913666(D0) 申请公布日期 1999.08.11
申请号 GB19990013666 申请日期 1999.06.11
申请人 NEC CORPORATION 发明人
分类号 H01L21/762;H01L21/329;H01L21/336;H01L21/84;H01L27/12;H01L29/06;H01L29/40;H01L29/78;H01L29/786;H01L29/861 主分类号 H01L21/762
代理机构 代理人
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