| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device effective from the viewpoint of maintenance and used particularly in a semiconductor package manufacturing process by adopting a uniform pressing means of differential gear mechanism in place of a hydraulic circuit to prevent the oil leakage and oil mist jetting, and simplifying remarkably the structure and control. SOLUTION: A resin sealing device is provided with a housing 10 moved in the resin thrust force axis C-C direction by the pushing-in force F from a mold driving device 11. A plurality of plungers 40-45 are carried on the housing 10 and moved integrally and also displaced independently. Uniform resin thrust force is provided to respective plungers by the movement of the housing 10 and resin tablets as a raw material in a molding tool are pressurized to resin seal parts corresponding to respective plungers. A differential gear mechanism carried on the housing 10 and distributing the resin thrust force uniformly to respective plungers is constituted of a root pinion gear 20, a pair of root racks 30 facing each other, different diameter coaxial pinion gears 21 connected integrally and movably on the root racks 30 and the like. |
