| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition which is useful as a high performance copper lead frame excellent in resistance to soldering heat by using a specific curing accelerator in a composition containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler as essential components. SOLUTION: This composition contains (A) an epoxy resin, (B) a curing agent, (C) an azabicyclo compound represented by the formula (n is an integer of 2-10) and (D) an inorganic filler as essential components. The amount of the component C is preferably 0.1-15 pts.wt. per 100 pts.wt. of the component A. Thus, good fluidity, high adhesion to copper lead frame, low water absorption and low coefficient of linear expansion can be attained. |
