| 摘要 |
PROBLEM TO BE SOLVED: To provide a high polishing rate while ensuring a flatness in a substrate surface. SOLUTION: In a substrate polishing device in which a substrate holding bed 3 for holding a substrate 4 is arranged being opposed to a polishing plate 1, the substrate holding bed 3 incorporates a medium supply system 5 for supplying a temperature control medium such as gas of liquid. The substrate holding bed 3 also incorporates a medium circulating part 9 for circulating the temperature control medium fed from the medium supply system. |
