| 摘要 |
The use of a hardenable epoxy resin mixture as a sealing compound for electrotechnical or electronic components is disclosed. The sealing compound is characterised in that the mixture contains a silicone-modified epoxy resin in which the organic, epoxy group-containing fractions are chemically bound to silicone fractions, as well as an amount from 40 to 75 % by weight, in relation to the hardenable epoxy resin mixture, of a mineral, optionally silanated filler that regulates the thermal expansion behaviour of the sealing mass. These hardenable epoxy resin mixtures are used in a particularly advantageous manner to seal diodes. |
| 申请人 |
ROBERT BOSCH GMBH, 70469 STUTTGART, DE |
发明人 |
PFANDER, WERNER, DIPL.-ING., 70734 FELLBACH, DE;JENNRICH, IRENE, 71364 WINNENDEN, DE;SPITZ, RICHARD, DIPL.-PHYS., 72766 REUTLINGEN, DE;KOEHLER, UWE, DIPL.-ING. FH, 71686 REMSECK, DE;SCHULER, SIEGFRIED, DIPL.-PHYS., 72829 ENGSTINGEN, DE |
