| 摘要 |
PURPOSE: To obtain an adhesive sheet which can simply and surely remove a resist on an unnecessary article in the preparation of a semiconductor and a circuit. CONSTITUTION: This adhesive sheet for stripping a resist, comprises a substrate film bearing a photocurable, pressure-sensitive adhesive comprising a pressure- sensitive adhesive polymer, a nonvolatile unsatd. compd. having one or more unsatd. double bonds in its molecule, a photopolymn. initiator, and a polymn. inhibitor. The adhesive sheet is applied onto an unnecessary article with a resist pattern, and the adhesive is photocured, followed by stripping of the adhesive sheet together with the resist material. |
