Flip-Chip-Verfahren zur Verbindung eines Halbleiterchips

摘要

A process for flip-chip connection comprises the steps of forming a plurality of spacer bumps 9 on the periphery of the semiconductor chip 6, forming a plurality of solder bumps 5 on the main chip surface, providing a cutting groove 10 between the solder bumps 5 and the spacer 9, aligning the solder bumps 5 on the semiconductor chip with the corresponding solder bumps on the circuit board 7, heating the assembly in order to merge the mating solder bumps 5 and thus to form the flip-chip connection, and breaking away the outer peripheral portion of the semiconductor chip 6 along the cutting groove 10 thereby removing the spacer bumps 9.