MOUNTING STRUCTURE BODY OF INTEGRATED CIRCUIT CHIP AND ITS MOUNTING METHOD,申请号JP19950159386-传众专利搜索

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发明名称	MOUNTING STRUCTURE BODY OF INTEGRATED CIRCUIT CHIP AND ITS MOUNTING METHOD
摘要
申请公布号	JPH08186150(A)	申请公布日期	1996.07.16
申请号	JP19950159386	申请日期	1995.06.26
申请人	SANSEI DENKAN KK	发明人	BOKU CHINU
分类号	H01L21/60;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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