发明名称 Coil winding wire contacting method for miniature relay mfr
摘要 The method involves contacting the winding wire (12) of a coil with a contact pin (10). An end section of the winding wire is wrapped around an end section (11) of the contact pin with several coils. The contact pin is then brought into contact with a liquid-free soft solder (14). The solder is melted by contact free supply of heat under protective gas for solder temperatures. The wound end section of the contact pin is arranged in the region of two electrodes (2,3) which have their tips facing each other. A light arc (5) is ignited between the two electrodes whose strength and duration is matched to the melting of the soft solder.
申请公布号 DE4439391(A1) 申请公布日期 1996.05.09
申请号 DE19944439391 申请日期 1994.11.04
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 DITTMANN, MICHAEL, DIPL.-ING., 12207 BERLIN, DE;VOJTA, ERICH, 91334 HEMHOFEN, DE
分类号 B23K1/00;H01F41/10;H01R43/02;(IPC1-7):H01F41/10;B23K9/16;H01H49/00;B23K3/047 主分类号 B23K1/00
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