发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To automatically set the height of a wire loop by calculating the midpoint of the wire loop based on the coordinates of a first bonding point and a second bonding point, and controlling the bonding wedge so as to pass the intermediate point. CONSTITUTION:The coordinates of a first bonding point A and a second bonding point E are set as (XA, YA, ZA), (XE, YE, ZE), respectively. When the positions of the points are designated, positions of the passing poinsts B, C, D of the wedge are calculated from equations I, II, III where W is wire size, H is step- difference, R is distance and theta is angle. The bonding wedge 1 is controlled so as to pass the positions of the obtained passing points. Thereby an excellent wire loop shape free from irregularity can be obtained. Hence a wire loop can be formed by designating only the two points of the first bonding point A and the second bonding point E.
申请公布号 JPH06124973(A) 申请公布日期 1994.05.06
申请号 JP19920274544 申请日期 1992.10.13
申请人 M M T:KK 发明人 NAKAMURA TADAO
分类号 H01L21/60 主分类号 H01L21/60
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