WAFER VACUUM-SUCKING DEVICE

摘要

PURPOSE:To accurately hold a wafer (with high flatness) by vacuum suction without bending moment due to irregular vacuum-suction force of a wafer vacuum-sucking device and without deformation of the wafer due to adherence of a foreign matter. CONSTITUTION:A wafer vacuum-sucking device comprises a wafer outer periphery rim 1 and a hole periphery rim 2 for holding in contact with a wafer 5 with sealability with the atmosphere on the same surface as a board 4 made of ceramic as a base material, and a vacuum fitting 7 formed of a columnar protrusion 3 for holding in contact with the wafer 5 to pipe with a vacuum passage 6 for evacuating in vacuum the wafer 5.