STRUCTURE FOR DISSIPATING HEAT OF PARTS OF PRINTED CIRCUIT BOARD

摘要

PURPOSE:To enhance the cooling efficiency of a structure for dissipating heat of the high heat generatiang parts mounted on a printed circuit board close to one another and to protect the cooling capability of the heat dissipating structure from being dropped when the heat dissipating structure is applied to an electronic aparatus consisting of a multistaged shelves mounted with printed circuit boards. CONSTITUTION:An electronic apparatus, where printed circuit boards 1 mounted with high heat generatiang parts 2 are mounted on shelves has heat pipes 5 installed on the mounting surface of a printed circuit board 1 so that the heat absorbing ends 5A of heat pipes 5 touch high heat generatiang parts 2 while the heat radiatiang ends 5B thereof are positioned outside the shelves, and pipes 30 with heat radiating ends 5B protruding inside the pipes 30 are installed perpendicularly to the heat pipes 5 in the front or back of the shelves. Coolant 35 flows through the pipes 30.