LOET-FLUSSMITTEL UND LOETPASTENZUSAMMENSETZUNG

摘要

Soldering flux and solder paste compositions which are non-acidic, low-residue and non-corrosive, leaving no substantial residue after soldering without a subsequent cleaning process and yet exhibiting excellent solderability comprise (A) at least one compound which generates a peroxide by decomposition or oxidation when subjected to heating, and (B) at least one ester from an inorganic or organic acid which generates an acid by decomposition in the presence of compound (A). They are particularly advantageous for eliminating the cleaning process with a chlorofluorocarbon solvent to solve the ozone layer destruction problem and for improving the performance of the in-circuit test for printed-circuit boards after soldering. Compound (A) may be an ester such as ethyleneglycol monomethyl ester; an ester such as dimethyl phtholate; or an unsaturated alcohol such as alkyl alcohol. The ester may be a phosphoric ester, a phosphorous ester, a hypophosphite ester, a boric ester, a gallic ester or a salicylic ester.