| 摘要 |
<p>PURPOSE:To obtain a semiconductor device in which the work efficiency is elevated and besides which is high in reliability by soldering a semiconductor element for power on the top of a heat radiating plate with medium temperature solder, and soldering electronic parts to the insulating layer on the heat radiating plate under low temperature, and then applying low temperature solder by the use of a printing mark. CONSTITUTION:A recess 13 of a depth that a semiconductor element 5 for power can be mounted to sink is provided on the topside of a heat radiating plate 11, and the semiconductor element 5 for power is soldered on the bottom of this recess 13 through an insulating layer 12 with medium temperature solder 14, and low temperature solder 16 is applied, using a printing mask 18, on the insulating layer 12 at the top of the heat radiating plate 11, and electronic parts 7 are soldered with low temperature solder 16. Hereby, a semiconductor device high in reliability can be obtained, in which low temperature soldering can be done excellently in work efficiency and in which a semiconductor element relatively large in capacity is soldered at a medium temperature.</p> |
