| 摘要 |
PURPOSE:To easily mount a semiconductor element on different packages by a method wherein a figure data of a chip is input to a CAD apparatus, a wiring standard is compared and judged and common positions of pads to be connected on a lead frame and on the semiconductor element are designed. CONSTITUTION:An external-shape data of a semiconductor chip 3 is input to a CAD apparatus. The chip 3 is mounted on a mounting part of a lead frame; temporarily set imaginary electrode pad positions of a pad arrangement line 5 connected to the center of electrode pads of the chip 3 are connected to inner leads 1 corresponding to them. Then, temporarily wired lines are compared with a wiring standard regarding whether they are within a prescribed length or whether an inclination angle to a horizontal line of interconnections is within a prescribed value; it is judged whether they are within a prescribed value. A connectable range 4 which is set by the electrode pads to be connected to the individual leads 1 is decided. Then, positions of the electrode pads, i.e., pad coordinates 6, are set in positions to make the interconnections shortest in a position range common to the lead frame. Thereby, it is possible to obtain an element which can be mounted on different packages. |
