| 摘要 |
PURPOSE: To improve heat resistance and impact resistance by forming and IC card substrate of a resin obtained by mixing specific resins. CONSTITUTION: An IC card substrate is formed of a resin obtained by mixing an acrylnitrile-butadiene-styrene copolymeric resin (hereafter called ABS resin) with a polycarbonate resin (hereafter called PC resin). The resin obtained by mixing the ABS resin with the PC resin is a mixed resin or a polymer alloy. Therefore, these two resins sometimes come out in the form of a rebounding in addition to the formation of a mixed composition between the two resins. The PC resin is preferably in the blending ratio of 15-85 wt.% to the whole mixed resin. When the blending ratio of the PC resin is not more than 15%, improvement of the heat resistance is not ensured compared to the case with the card substrate formed of the ABS resin alone and neither is the improvement of anticracking properties expected. On the other hand, when the blending ratio is 85% or more, disadvantageously the manufacturing cost of the card substrate increases and at the same time, the moldability of a thin card is deteriorated. |
