Hybrid thick film circuit device

摘要

A hybrid thick film chip device comprising two or more electrical components mounted in parallel on a single substrate and having common terminals for electrical interconnection to other devices or to circuit boards or the like. In one embodiment, the components comprise a resistor and a capacitor disposed on one surface of the substrate. In another embodiment the resistor is on one surface of the substrate and the capacitor is on the opposite surface. The device is particularly advantageous in forming networks.