| 摘要 |
<p>PURPOSE:To make it possible to remove a defective semiconductor chip in a short time by a method wherein an adhesive sheet, on which the adhesions of the positions of semiconductor chips are changed according to the semiconductor chips being nondefective or defective, is used at the time of a semiconductor wafer being divided into pieces. CONSTITUTION:A part, which corresponds to the position of a detective semiconductor chip on a semiconductor wafer, of a shutter 2 superposed on the side of the adhesive surface coated with an adhesive 11 of an adhesive sheet 1 is opened on the basis of data on the position of the defective semiconductor chip and ultraviolet light is irradiated from an ultraviolet lamp 3. The adhesive 11 of the adhesive surface, which is irradiated with the ultraviolet light, of the sheet 1 is cured and becomes an adhesive 12, whose adhesion is reduced. Then, the position of the semiconductor wafer 4 is conformed to the adhesive surface of the sheet 1 and the wafer is adhered. Then, by pushing the outer periphery of the sheet 1 from the side opposite to the adhesive surface using a hemispherical pushing jig 7, the defective semiconductor chip 6 located at a position, whose adhesion is reduced, falls from the sheet 1 and nondefective semiconductor chips 5 only are left on the sheet and are selected.</p> |
