| 摘要 |
<p>PURPOSE:To bring a semiconductor device to a multifunction state by constituting both surfaces of one lead frame so as to be utilized independently. CONSTITUTION:At least one semiconductor integrated circuits 15a, 15b are placed respectively onto semiconductor base sections 16a, 16b in a lead frame for a semiconductor device to which surface treatment 18a, 18b are executed. The semiconductor integrated circuits placed onto both surfaces are electrically brought into contact respectively with an external circuit through wires 17a, 17b, inner leads 13a, 13b, and the outer leads 18a, 18b, and operated. Since two metallic plates for the lead frame are electrically insulated completely by a nonconductive film 11, the semiconductor integrated circuits 15a and 15b can be worked independently without mutual interference. Accordingly, two or more of the semiconductor integrated circuits are placed onto one lead frame, and can be operated separately, thus bringing the semiconductor device to a multifunction state.</p> |
