| 摘要 |
PURPOSE:To improve the heat dissipation by using a clad tape having good thermal conductivity as a base metal and bonding a chip to a chip bonding unit through an Au-Si eutectic alloy layer. CONSTITUTION:A clad tape 2 which has a good thermal conductor in a surface layer is used as a base metal of a leadframe 1. An Fe-Ni alloy plating layer 3 having a thickness of 0.5-5.0mum is formed on the outer lead of the tape 2. An Si chip 4 is placed on a chip bonding unit 5 through an Au-Si or Au-Ge eutectic bond 6. In this manner, good heat dissipation can be obtained. |
