| 摘要 |
PURPOSE:To reduce the floating capacity between wiring patterns and to realize the more rapid reading of images by removing an insulating layer except the insulating layer formed on the lower side of the wiring pattern. CONSTITUTION:When only a lower layer wiring pattern 2 is already formed, the lower layer wiring pattern 2 is formed in the state of being projected from an insulating substrate 1. If an upper layer wiring pattern 5 is already formed, at least one layer wiring patterns 2, 5 and an interlayer insulating film layer 3 are prcjeoted from the insulating substrate 1. The insulating film layer 3 between the adjacent wiring patterns 2, 5 is removed and the floating capacity C generated between the adjacent wiring patterns 2, 5 can be reduced. Consequently, it is especially effective for the matrix wiring region of a close adhesive type image sensor module substrate wherein many parallel adjacent patterns which have a very long distance exist between a signal wire pattern and an earth wire pattern. |
